General-purpose porous copper foam sheet made from pure copper via electroplating sintering. Valued for high electrical/thermal conductivity in battery electrode substrate and electrochemical applications. Size is customizable on request.
| Material | Pure copper |
| Process | Electroplating sintering |
| Pore size | 0.1–1 mm (5–120 PPI) |
| Porosity | 50–98% |
| Through-hole rate | ≥98% |
| Bulk density | 0.1–0.8 g/cm³ |
| Size | Customizable |
Türkçe
Engilish
