Super-thick pure copper foam available in the 5–25mm thickness range. Used for high-volume heat transfer, filtration, and structural porous-metal applications.
Key Features
- Pure copper (Cu) material
- Super-thick: 5–25 mm
- Electroplating sintering process
- ~98% through-hole rate, ~95% porosity
Technical Specifications
| Material | Pure copper |
| Thickness | 5–25 mm |
| Process | Electroplating sintering |
| Pore size | 0.1–1 mm (5–120 PPI) |
| Porosity | 50–98% |
| Through-hole rate | ≥98% |
Applications
- Heat exchanger / heat-transfer applications
- Structural porous copper components
- Industrial filtration
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