Ultra-thin pure copper foam available in the 0.04–0.3mm thickness range. Used where a thin electrode substrate is required for lithium-ion battery and electrochemistry research. Specific thickness available on request.
| Material | Pure copper |
| Thickness | 0.04–0.3 mm |
| Process | Electroplating sintering |
| Pore size | 0.1–1 mm (5–120 PPI) |
| Porosity | 50–98% |
| Through-hole rate | ≥98% |
Türkçe
Engilish
